Enclosure for a solid state overload relay mechanism or...

H - Electricity – 02 – B

Patent

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Details

H02B 1/46 (2006.01) H01H 45/04 (2006.01) H01H 71/02 (2006.01) H02B 1/04 (2006.01) H02B 1/48 (2006.01)

Patent

CA 2178759

An enclosure (10) for a solid state overload relay mechanism (100) or other device. The enclosure (10) includes a mounting plate (12) defining a pair of upwardly extending flanges (14). A housing (16) includes a lower housing (18) and an upper housing (20). The mounting plate flanges (14) are received through slotted openings (22) defined by the lower housing (18) and define openings (26) for engaging a tab member (28) defined by the lower housing (18). Each tab member (28) is received within and engaged with a corresponding opening (26) defined by a flange (14). A constant pressure is maintained between the tab member (28) and the mounting plate flange opening (26) such that the relative position between the two is fixed. Mounting profiles (36) are defined by the mounting plate (12) and extend away from the lower housing (18) for retrofitting an existing device. The upper and lower housings (18, 20) are held in a conventional snap-fit manner.

Une enceinte (10), destinée à un mécanisme de relais de surchage à semiconducteurs (100), ou à d'autres dispositifs, comprend une plaque de montage (12) définissant une paire de brides (14) partant vers le haut. Un boîtier (16) comprend une partie inférieure (18) et une partie supérieure (20). Les brides (14) de plaques de montage passent dans des ouvertures en fentes (22) définies par la partie inférieure du boîtier (18) et elles définissent des ouvertures (26) permettant l'entrée en prise d'une languette (28) définie par la partie inférieure du boîtier (18). Chaque languette (28) passe dans une ouverture correspondante (26) définie par une bride (14) et y entre en prise. Une pression constante est appliquée entre la languette (28) et l'ouverture (26) des brides de plaques de montage de façon que soit maintenue leur position relative. Des profils de montage (36) sont définis par la plaque de montage (12) et partent de la partie inférieure du boîtier (18) pour permettre l'adaptation d'un dispositif existant. Les parties supérieure et inférieure du boîtier (18, 20) sont assujetties par un encliquetage conventionnel.

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