High density electronics package having stacked circuit boards

Details High density electronics package having stacked circuit boards High density electronics package having stacked circuit boards

H - Electricity

05

K

H05K 7/20 (2006.01) H01L 25/065 (2006.01) H05K 7/02 (2006.01)

Patent

CA 2101140

A high-density electronics package (10) that houses a plurality of circuit cards(21, 22, 25, 26), heat sinks (23, 27) and circuit interconnections (33) in a single hous- ing (12). The electronics package (10) uses conical shaped interfaces for locating and locking components, which greatly enhances the serviceability, thermal management and strength of the electronics package (10). Assembly is accomplished by using a selected conical angle on a first heat sink (23) that mates with a matching conical surface (13) on the housing (12). A second heat sink (27) has a conical angle (located in the opposite direction of the conical angle of the first heat sink) that mates with an identical angle on an expandable wedge ring (31) used for positioning purposes. This mounting feature provides automatic heat sink to heat sink axial alignment regardless of tolerances, therefore simplifying assembly and providing intimate contact between the heat sinks (23, 27) and the housing (12), and thus creating a thermal path from the circuit cards (21, 22, 25, 26) to the housing (12). A model of the electronics package (10) has been designed, built and tested, and provides a lightweight, thermally conductive, and structurally sound electronics package (10). The present packageconcept also provides for greater serviceability, easier fabrication, faster assembly, lower cost and increased design latitude. The electronics package (10) is easilyfabricated and requires no special tooling. Assembly of components into the housing (12) is accomplished within minutes and disassembly is equally fast and easy.

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