Method and device for bonding a wire conductor

Details Method and device for bonding a wire conductor Method and device for bonding a wire conductor

H - Electricity

01

F

H01F 41/04 (2006.01) G06K 19/077 (2006.01) H05K 7/06 (2006.01)

Patent

CA 2449413

Process and device for the contacting of a wire conductor in the course of the manufacture of a transponder unit arranged on a substrate and comprising a wire coil and a chip unit, wherein in a first phase the wire conductor is guided away via the terminal area, or a region accepting the terminal area and is fixed on the substrate relative to the terminal area or the region assigned to the terminal area, and in a second phase the connection of the wire conductor to the terminal area is effected by means of a connecting instrument.

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