Method of manufacturing a multilayered circuit board

Details Method of manufacturing a multilayered circuit board Method of manufacturing a multilayered circuit board

H - Electricity

05

K

H05K 3/00 (2006.01) H05K 3/46 (2006.01) H05K 1/03 (2006.01) H05K 1/09 (2006.01)

Patent

CA 2066024

2066024 9107073 PCTABS00005 A method of manufacturing a multilayered circuit board, comprises the steps of: (a) laminating an insulating sheet on a lower layer (2) which reflects a laser light applied through the insulating sheet (4 and 6), said insulating sheet comprising a carrier film (4) and an insulating layer (6) formed on the carrier film; (b) forming via holes (8) in predetermined parts of said insulating sheet by applying a laser light thereto; (c) filling a conductive material (10) in the via holes formed in said insulating sheet; (d) forming a circuit-pattern layer (12) on said insulating layer with the via holes filled with the conductive material; (e) repeating steps (a) to (c) on an uppermost insulating sheet, and repeating steps (a) to (d) until a desired number of circuit-pattern layers are formed below said insulating sheet, in the case where the board has at least two circuit-pattern layers; and (f) firing the layers of the multilayered structure formed in the step (e) at the same time.

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