Adhesive composition and adhesive composition-applied laminate

Details Adhesive composition and adhesive composition-applied laminate Adhesive composition and adhesive composition-applied laminate

C - Chemistry, Metallurgy

09

J

C09J 123/04 (2006.01) B32B 7/12 (2006.01) B32B 27/32 (2006.01) C09J 123/06 (2006.01) C09J 123/08 (2006.01) C09J 133/02 (2006.01)

Patent

CA 2064434

A adhesive composition comprising (A) a substantially linear, low-density polyethylene, (B) a high pressure low-density polyethylene, (C) an ethylene-based polymer modified with an unsaturated carboxylic acid or a derivative thereof, the ethylene-based polymer being an ethylene homopolymer or a random copolymer formed from ethylene and an .alpha.-olefin other than ethylene in which the .alpha.- olefin makes up not more than 10 mold based on the total molar amount of the ethylene and the .alpha.-olefin, and (D) a tackifier, the amount of each of Components (A), (B), (C) and (D) being respectively 30 to 80 % by weight, 1 to 50 % by weight, 1 to 30 % by weight and 1 to 30 % by weight, based on the total amount of Components (A), (B), (C) and (D). The adhesive composition may further contain an ethylene/.alpha.-olefin random copolymer as Component (E) in an amount of not more than 30 % by weight based on the total amount of Components (A) to (D) and (E). This adhesive composition has improved adhesion properties particularly to paper.

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