Copper on polymer component having improved adhesion

Details Copper on polymer component having improved adhesion Copper on polymer component having improved adhesion

H - Electricity

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H01L 23/485 (2006.01) C23C 14/02 (2006.01) C23C 14/20 (2006.01) C23C 14/22 (2006.01) C25D 5/00 (2006.01) C25D 5/02 (2006.01) H05K 3/38 (2006.01)

Patent

CA 2327801

A component for use in manufacturing electronic interconnection devices, comprised of a polyimide film having a thickness of between about 12 µm and about 125 µm. A chromium tiecoat on a surface of the polyimide film, the chromium tiecoat having a thickness of between about 300 .ANG. and about 350 .ANG. and a copper layer on the tiecoat, the copper layer having a thickness between about 300 .ANG. and about 70 µm.

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