Ultrasonic vibration bonding method

Details Ultrasonic vibration bonding method Ultrasonic vibration bonding method

B - Operations, Transporting

23

K

B23K 20/10 (2006.01) H05K 13/04 (2006.01)

Patent

CA 2291296

An ultrasonic vibration bonding method comprising placing metal portions to be bonded formed on a base portion of a first member upon metal portions to be bonded of a second member, pressing the first and second members with a resonator and a mounting table elastically while the base portion of the first member is located on a bonding working portion side of the resonator and the second member is located on a mounting table side, and bonding together the portions to be bonded of the first and second members with ultrasonic vibration transmitted to the resonator from a transducer. This ultrasonic vibration bonding method can improve work efficiency and prevent a connection failure and resin breakage.

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