Adhesive applicator device

Details Adhesive applicator device Adhesive applicator device

B - Operations, Transporting

05

C

B05C 5/02 (2006.01) B05C 5/04 (2006.01) B05C 5/00 (2006.01)

Patent

CA 2305662

The applicator device (AV) for hot-melt adhesive (HK) comprises a housing (1) with an adhesive feeder element (2) and an adjustable nozzle slot (3) to let out the adhesive by pressure. The nozzle slot (3) can be adjusted by means of two nozzle sliders (4) that can be displaced linearly and continuously towards each other from a zero position to a maximum open position with the purpose of adjusting the width (B) of the adhesive applicator. Both sliders (4) are displaced synchronously or independently towards each other, whereby both sliders (4) can be displaced towards each other by the same distance and/or by a different distance from the center (0) of the application width (B) of the nozzle slot (3).

L'invention concerne un applicateur (AV) pour adhésif thermofusible (HK), présentant un boîtier (1) avec une alimentation en adhésif (2) et une fente de buse réglable (3) pour la sortie de l'adhésif sous pression. La fente de buse (3) est réglable par l'intermédiaire de deux coulisseaux de buse (4) de manière à ajuster la largeur d'application (B) de la colle, en continu, de zéro à une valeur maximale. Les deux coulisseaux (4) sont déplacés l'un par rapport à l'autre de manière synchronisée ou indépendante, à partir du centre (0) de la largeur d'application (B) de la fente de buse (3), sur une même distance et/ou sur une distance différente.

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