C - Chemistry – Metallurgy – 08 – J
Patent
C - Chemistry, Metallurgy
08
J
C08J 9/32 (2006.01) B29C 70/66 (2006.01) C09J 107/00 (2006.01) C09J 109/02 (2006.01) C09J 109/06 (2006.01) C09J 123/02 (2006.01) C09J 123/08 (2006.01) C09J 123/22 (2006.01) C09J 201/00 (2006.01) C08K 7/22 (2006.01)
Patent
CA 2709713
Adhesive, more particularly pressure-sensitive adhesive, which comprises expanded microballoons, the bond strength of the adhesive comprising the expanded microballoons being reduced by not more than 30%, preferably not more than 20%, more preferably 10%, in comparison to the bond strength of an adhesive of identical coatweight and formula which has been defoamed by the destruction of the voids produced by the expanded microballoons.
L'invention concerne une matière adhésive, en particulier sensible à la pression, qui contient des microbilles expansées. Comparativement au pouvoir adhésif d'une matière adhésive de grammage et de formulation identiques qui est démoussée par la destruction des espaces creux créés par les microbilles expansées, le pouvoir adhésif de la matière adhésive contenant les microbilles expansées est réduit d'au plus 30%, de préférence d'au plus 20%, idéalement de 10%.
Buenz Stephan
Burmeister Axel
Kreft Christian
Thormeier Sabine
Zmarsly Franziska
Gowling Lafleur Henderson Llp
Tesa Se
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