C - Chemistry – Metallurgy – 08 – L
Patent
C - Chemistry, Metallurgy
08
L
400/5301
C08L 83/04 (2006.01) C08L 101/00 (2006.01)
Patent
CA 2033316
SILICON-MODIFIED THERMOPLASTIC RESIN ABSTRACT There is disclosed a thermoplastic resin composition comprising a thermoplastic resin and an organopolysiloxane having a viscosity of at least 150,000 centistokes at 25°C, wherein the organopolysiloxane contains no more than 2,000 parts per million by weight of low molecular weight siloxane species having a vapor pressure of ? 10 mm Hg at 200°C. These compositions are particularly useful as injection molding resins and show superior results to prior art systems with respect to mold staining during molding, absence of gloss at molding surfaces, lack of "silver streaks" in molded objects and improved weld line strength.
Furukawa Haruhiko
Imai Takeshi
Dow Corning Toray Silicone Company Ltd.
Gowling Lafleur Henderson Llp
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