Single use cutting substrate and/or support surface and...

B - Operations – Transporting – 32 – B

Patent

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B32B 3/02 (2006.01) A47J 47/00 (2006.01) B32B 3/24 (2006.01) B32B 7/14 (2006.01) B32B 27/06 (2006.01) B32B 27/32 (2006.01) B32B 38/04 (2006.01) B32B 38/06 (2006.01)

Patent

CA 2475816

A processing substrate comprises a first cut-resistant layer (60) having a first surface area and including a first absorbent ply and a thermoplastic material ply. The processing substrate further includes a second layer (62) having a second surface area and including a second absorbent ply and a thermoplastic material ply, wherein the first layer (60) is secured to the second layer (62) such that a portion of the second surface area is laterally disposed outside of the first surface area.

L'invention concerne un substrat de traitement comprenant une première couche résistant aux coupures qui présente une première surface comportant une première feuille absorbante et une feuille de matériau thermoplastique. Ledit substrat de traitement comprend en outre une seconde couche qui présente une seconde surface comportant une seconde feuille absorbante et une seconde feuille de matériau thermoplastique, ladite première couche étant fixée à la seconde couche de façon qu'une partie de ladite seconde surface soit latéralement disposée à l'extérieur de ladite première surface.

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