Bare ic chip for multichip module, multichip module,...

Details Bare ic chip for multichip module, multichip module,... Bare ic chip for multichip module, multichip module,...

Category

H - Electricity

Subcategory

05

Subsubcategory

K

IPC codes

H05K 13/04 (2006.01) H05K 3/36 (2006.01)

Type

Patent

Patent number

CA 2316532

Description

A bare IC chip for a multichip module which can suppress a drop in yield due to a defect in the bare IC chip when the multichip module is produced, a multichip module, an electronic equipment and a method for producing the multichip module are provided. A CCD bare IC chip (bare IC chip) which configures a reading module (multichip module) is provided with a first main circuit section including a plurality of first electrodes, and a second main circuit section including a plurality of second electrodes. The reading module (multichip module) is provided with the CCD bare IC chips (bare IC chips) having the first main circuit section including the plurality of first electrodes and the second main circuit section including the plurality of second electrodes. An image reading device (electronic equipment) has the CCD bare IC chips (bare IC chips) of the mounted reading module (multichip module) provided with the first main circuit section including the plurality of first electrodes and the second main circuit section including the plurality of second electrodes. The method of producing the reading module (multichip module) comprises a step of removing bonding wires from the first electrodes of the first main circuit section of a defective CCD bare IC chip (bare IC chip) and a step of connecting the second electrodes of the second main circuit section of the defective CCD bare IC chip (bare IC chip) to the printed circuit board by the bonding wires.

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