Multifunction lead frame and integrated circuit package...

Details Multifunction lead frame and integrated circuit package... Multifunction lead frame and integrated circuit package...

H - Electricity

01

L

H01L 23/495 (2006.01)

Patent

CA 2321537

The present invention provides a lead frame for use in packaging a circuit having a discrete component, and a method of manufacture thereof. In one embodiment, the lead frame includes a lead support structure and a plurality of severable leads that are coupled to the lead support structure. The plurality of severable leads extend inward from the lead support structure to predetermined locations corresponding to terminals of the discrete component.

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