C - Chemistry – Metallurgy – 25 – D
Patent
C - Chemistry, Metallurgy
25
D
C25D 5/22 (2006.01) C25D 5/00 (2006.01) C25D 5/02 (2006.01) C25F 3/02 (2006.01) C25F 7/00 (2006.01) H05K 3/07 (2006.01) H05K 3/24 (2006.01)
Patent
CA 2191339
The invention relates to a method or continuous uniform electrolytic metallising or etching of metal surfaces, and to a device suitable for carrying out this method. The invention is particularly suitable for treating printed circuit boards and conductive films in installations through which the material for treatment passes horizontally. In order to avoid metal coatings of differing thicknesses being deposited on narrow and wide conductor strips in printed circuit boards, according to the present invention operation is with movable, preferably rotating roller-haped intermediate electrodes, which roll without short circuit at a very close effective distance above the material for treatment, or which contact the said material in a wiping manner. These intermediate electrodes are not electrically connected to the source of bath current and are located between the surface of the material for treatment and a suitable counter-electrode.
L'invention concerne un procédé de métallisation ou d'attaque électrolytique homogène et continue de surfaces métalliques, ainsi qu'un dispositif approprié pour sa mise en oeuvre. L'invention se prête en particulier au traitement de cartes de circuits imprimés et de feuilles conductrices dans des unités dans lesquelles le matériau à traiter passe horizontalement. Ce procédé permet d'éviter que des couches métalliques d'épaisseur différente ne se déposent sur les tracés conducteurs étroits et larges des cartes de circuits imprimés. A cet effet, ce procédé utilise des électrodes intermédiaires (22), mobiles, de préférence rotatives, de forme cylindrique, qui roulent au-dessus du matériau à traiter (19, 25), à très courte distance du matériau, sans provoquer de court-circuit, ou qui touchent le matériau dans un mouvement de balayage. Ces électrodes intermédiaires ne sont pas raccordées électriquement à la source de courant du bain et se trouvent entre la surface du matériau à traiter et une contre-électrode appropriée (21, 27).
Atotech Deutschland Gmbh
Riches Mckenzie & Herbert Llp
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