Tin plating electrolyte compositions

Details Tin plating electrolyte compositions Tin plating electrolyte compositions

C - Chemistry, Metallurgy

25

D

C25D 3/32 (2006.01) C25D 7/06 (2006.01)

Patent

CA 2234101

There is disclosed a composition suitable for use in a process for electroplating surfaces with tin, comprising: an unsubstituted or substituted para alkylbenzene sulphonic acid (component a), one or more acids capable of giving good plating at low current density (component b), one or more addition agents, a tin source, water. There are also described methods of tin plating by the compositions of the invention.

L'invention concerne une composition pouvant être utilisée dans un procédé d'étamage électrolytique et comprenant: un acide sulfonique de para alkylbenzène substitué ou non (constituant a), un ou plusieurs acides capables de donner une bonne qualité d'étamage à basse densité de courant (constituant b), un ou plusieurs agents d'addition, une source d'étain, de l'eau. L'invention concerne également des procédés d'étamage mettant en application les compositions décrites par l'invention.

Affiliated with

Also associated with

Rating

Tin plating electrolyte compositions does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Tin plating electrolyte compositions, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Tin plating electrolyte compositions will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-1912606