Method of preparing an integrated circuit die for imaging

Details Method of preparing an integrated circuit die for imaging Method of preparing an integrated circuit die for imaging

H - Electricity

01

L

H01L 21/66 (2006.01) H01L 21/302 (2006.01)

Patent

CA 2521675

Integrated circuit dies are prepared for imaging by completely etching away all metal from the metal lines without removing barrier layers that underlie the metal lines. The metal vias may also be removed, especially if they are formed from the same metal as the metal lines, as in copper damascene circuits. This provides high contrast images that permits circuit layout extraction software to readily distinguish between metal lines and vias.

Puces de circuits intégrés sont préparés pour l'imagerie en enlevant complètement à l'acide tous les métaux de lignes métalliques sans avoir à retirer des couches de barrière qui constituent les composantes fondamentales des lignes métalliques. Les vias métalliques peuvent aussi être retirés, surtout s'ils sont formés à partir du même métal que les lignes métalliques, comme dans les circuits en cuivre damascène. Cela donne des images à contraste élevé qui permettent aux logiciels d'extraction de configurations de circuits de facilement faire la distinction entre les lignes métalliques et les vias.

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