C - Chemistry – Metallurgy – 08 – L
Patent
C - Chemistry, Metallurgy
08
L
400/4204
C08L 63/04 (2006.01) C08G 59/32 (2006.01) C08G 59/62 (2006.01) C08L 63/00 (2006.01)
Patent
CA 2008031
K-17425/= Curable epoxy resin compositions of matter containing a thermoplastic which has phenolic end groups Abstract Heat-curable compositions of matter which are stable on storage and which contain (a) 10-70 parts by weight of an epoxy resin having a functionality of at least 3, (b) 90-30 parts by weight of an epoxy resin having a functionality of 2-2.5, (c) a diphenol, the amount of the diphenol being so chosen that 0.6-1.2 hydroxylequivalents of the diphenol (c) are employed per epoxide equivalent of the epoxy resins (n) and (b), and (d) 10-150 parts by weight, relative to 100 parts by weight of the components (a) to (c), of a thermoplastic having phenolic end groups and having a glass transition temperature of at least 150°C which is compatible with the mixture of the components (a) to (c), are particularly suitable for the production of prepregs for fibre-reinforced composite materials or for the production of adhesive films. The cured shaped articles obtained therefrom are distinguished by a high heat distortion point and excellent mechanical strength properties.
Eldin Sameer H.
Schmid Rolf
Ag Ciba-Geigy
Fetherstonhaugh & Co.
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