Method and apparatus for solder leveling of printed circuit...

Details Method and apparatus for solder leveling of printed circuit... Method and apparatus for solder leveling of printed circuit...

H - Electricity

05

K

H05K 3/22 (2006.01) B23K 1/018 (2006.01) H05K 3/34 (2006.01)

Patent

CA 2054407

Disclosed is a mçthod and apparatus for fabricating workpieces such as printed circuit boards which include blowing excess solder off the board by a hot air solder leveling technique. A converging/diverging airknife design creates a shock wave, causing a high pressure, low velocity flow pattern which removes solder from the through-holes in the board while leaving sufficient solder on the surface mount features.

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