Integrated circuit package having a cooling mechanism

Details Integrated circuit package having a cooling mechanism Integrated circuit package having a cooling mechanism

H - Electricity

01

L

H01L 23/473 (2006.01) H01L 23/433 (2006.01)

Patent

CA 2081045

An integrated circuit package having a cooling mechanism according to the present invention comprises a plurality of integrated chips disposed to make a matrix and coolers utilizing jet impingement of liquid coolant for cooling which are positioned corresponding to the integrated circuit chips on a printed circuit board using a holding plate and are pressed against the integrated circuit chips with force at a predetermined level. A cooler comprises a cooling plate in contact with a top face of the applicable integrated circuit chip, a cylinder-shaped housing fixed to the cooling plate, a nozzle inserted to the housing to jet the liquid coolant practically to the center of the cooling plate and a draining tube to drain the liquid coolant impinged into the housing. It further comprises a supplying manifold to distribute the liquid coolant supplied form outside to each of the coolers and a draining manifold to collect and drain the liquid coolant flowing from the rows of coolers, and connecting tubes to connect the supplying manifold and the draining manifold with the coolers and to connect adjacent coolers.

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