Process for through-hole plating of two-layer circuit boards...

Details Process for through-hole plating of two-layer circuit boards... Process for through-hole plating of two-layer circuit boards...

H - Electricity

05

K

H05K 3/42 (2006.01) C25D 5/02 (2006.01) C25D 5/56 (2006.01) H05K 3/46 (2006.01)

Patent

CA 2088123

A process for through-hole plating of two-layer circuit boards and multilayers using polythiophenes as a conductive agent on the side walls of through-holes for the direct through-hole plating and to the circuit boards and multilayers thus produced.

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