Photosensitive compositions

Details Photosensitive compositions Photosensitive compositions

G - Physics

03

F

G03F 7/028 (2006.01) C08F 2/50 (2006.01) C08F 283/00 (2006.01) C08F 283/10 (2006.01) C08L 63/00 (2006.01) G03C 9/08 (2006.01) G03F 7/00 (2006.01) G03F 7/038 (2006.01)

Patent

CA 2111718

The invention relates to photosensitive compositions comprising A) from 40 to 80 % by weight of at least one liquid epoxy resin having an epoxy functionality of equal to or greater than 2, B) from 0.1 to 10 % by weight of at least one cationic photoinitiator for component A), C) from 5 to 40 % by weight of at least one liquid cycloaliphatic or aromatic diacrylate, D) from 0 to 15 % by weight of at least one liquid poly(meth-)acrylate having a (meth-)- acrylate functionality of greater than 2, the proportion of component D) constituting a maximum of 50 % by weight of the total (meth-)acrylate content, E) from 0.1 to 10 % by weight of at least one radical photoinitiator for component C) and, where appropriate, D) and F) from 5 to 40 % by weight of at least one OH-terminated polyether, polyester or poly- urethane, which are especially suitable, for example, for the manufacture of photopolymerised layers, especially of three-dimensional objects.

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