Solderless connection technique and apparatus

Details Solderless connection technique and apparatus Solderless connection technique and apparatus

H - Electricity

01

R

339/11.2

H01R 13/24 (2006.01) H01L 23/00 (2006.01)

Patent

CA 1104682

SOLDERLESS CONNECTION TECHNIQUE AND APPARATUS Abstract of the Disclosure Contact portions of a first array of conductive elements are urged against mating contacts of a second array by a pressure applicator comprising a resilient open celled plastic material to establish and maintain an electrical connection therebetween.

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