Semiconductor device with bumps

Details Semiconductor device with bumps Semiconductor device with bumps

H - Electricity

01

L

H01L 23/50 (2006.01) H01L 21/60 (2006.01) H01L 23/32 (2006.01) H01L 23/485 (2006.01) H01L 23/498 (2006.01)

Patent

CA 2095058

ABSTRACT OF THE DISCLOSURE The semiconductor chip is provided with bumps each formed by alternately building up two types of metal materials capable of forming an eutectic alloy, and, therefore, an eutectic alloy reaction takes place at each boundary surface between two layers. The entire bump fully melts in the reaction so that the semiconductor chip may be securely connected on the substrate.

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