Low profile modular phone jack and method of making same

H - Electricity – 01 – R

Patent

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Details

H01R 13/33 (2006.01) H01R 24/00 (2011.01)

Patent

CA 2225971

A modular phone jack (10) includes an outer dielectric housing (12) having a plug-receiving opening (26) formed in a forward mating end (28) of the housing. An inner dielectric insert (14) is positionable in the housing. A plurality of elongated terminals (16) are fixed to the dielectric insert. Each terminal includes a contact portion (16b) at one end extending diagonally into the plug-receiving opening and a tail portion (16c) at the opposite end extending from the housing. A comb structure (22a) secures the tail portions to the housing at predetermined spaced locations. A method of fabricating the modular phone jack (10) according to the above structure is contemplated.

Une prise modulaire de type téléphonique (10) comprend un logement diélectrique extérieur (12) muni d'une ouverture (26) pour branchement de fiches ménagée dans une extrémité d'accouplement avant (28) du logement. Un isolant diélectrique interne (14) est positionnable dans le logement. Plusieurs bornes allongées (16) sont fixées à l'isolant diélectrique. Chaque borne comprend une partie contact (16b) à une extrémité qui se prolonge en diagonale dans l'ouverture pour branchement de fiches et une partie arrière (16c) à l'extrémité opposée qui s'étend à partir du logement. Une structure à peigne (22a) retient les portions arrière au logement dans des espacements prédéterminés. On songe à une méthode de fabrication de la prise modulaire de type téléphonique (10) conformément à la structure susmentionnée.

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