Enclosure and printed circuit card with heat sink and...

Details Enclosure and printed circuit card with heat sink and... Enclosure and printed circuit card with heat sink and...

H - Electricity

05

K

H05K 7/20 (2006.01) H05K 3/28 (2006.01) H05K 7/14 (2006.01)

Patent

CA 2054926

11 ABSTRACT ENCLOSURE AND PRINTED CIRCUIT CARD WITH HEAT SINK AND MANUFACTURING PROCESS OF SUCH A CARD Cooling of a printed circuit card (10) with its components (13) is achieved by thermal conduction by associating with the card (10), a metal plate (15) forming a heat sink. The gap between the plate (15) and the card (10) which contains the electronic components (13) is filled with a pulp (16) with a high thermal conduction coefficient. The cards (10) can be housed in an enclosure with metal walls (12), itself able to be cooled by a thermosiphon system connecting it to a cold source. Refer to figure 2.

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