Thermoplastic molding compounds

Details Thermoplastic molding compounds Thermoplastic molding compounds

C - Chemistry, Metallurgy

08

L

C08L 55/02 (2006.01) C08K 5/098 (2006.01) C08K 5/101 (2006.01) C08K 5/103 (2006.01) C08K 5/20 (2006.01) C08L 25/12 (2006.01) C08L 25/16 (2006.01) C08L 33/20 (2006.01) C08L 39/04 (2006.01) C08L 51/04 (2006.01)

Patent

CA 2376451

The invention relates to thermoplastic molding compounds that contain (Co) polymers and graft polymers and 0.1 to 8 wt.-% of a combination of at least 3 components selected from the compounds (I), (II), (III) and (IV). (I) is a compound with at least one structural unit (a) wherein M = metal and n = valency of the metal M. Compound (II) is a compound with at least one structural unit (b) and compound (III) is a compound with at least one structural unit (c). Compound (IV) represents a compound that contains none of the structural units comprised by compounds (I) to (III).

La présente invention concerne des matières à mouler thermoplastiques contenant des polymères (Co), des polymères greffés et 0,1 à 8 parties en poids d'une combinaison d'au moins trois composants choisis parmi les composés (I), (II), (III) et (IV). I) est un composé comprenant au moins une unité structurelle (a) M = métal et n = valence du métal M, II) est un composé comprenant au moins une unité structurelle (b), III) est un composé comprenant au moins une unité structurelle (c) et IV) est un composé ne comprenant aucune des unités structurelles comprises dans les composés (I) à (III).

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