Extrudable and primerless adhesives and products therefrom

C - Chemistry – Metallurgy – 09 – D

Patent

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Details

IPC codes

C09D 151/06 (2006.01) B32B 7/12 (2006.01) B32B 27/28 (2006.01) C09D 123/08 (2006.01) C09D 133/00 (2006.01) C09J 151/06 (2006.01)

Type

Patent

Patent number

CA 2045273

Description

An extrudable bonding resin composition of (a) 65 to 99 percent of an ethylene copolymer portion of a copolymer of ethylene and 20 to 50 percent comonomer of acids, esters, and the like, and grafted sidechains of comonomer units selected from carboxylic acid, anhydride, salt, or half ester functionality, and optionally a compatible non-grafted ethylene copolymer, and (b) 1 to 35 percent by weight of a tackifying resin exhibits good adhesion properties without the need for a primer.

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