C - Chemistry – Metallurgy – 09 – D
Patent
C - Chemistry, Metallurgy
09
D
C09D 151/06 (2006.01) B32B 7/12 (2006.01) B32B 27/28 (2006.01) C09D 123/08 (2006.01) C09D 133/00 (2006.01) C09J 151/06 (2006.01)
Patent
CA 2045273
An extrudable bonding resin composition of (a) 65 to 99 percent of an ethylene copolymer portion of a copolymer of ethylene and 20 to 50 percent comonomer of acids, esters, and the like, and grafted sidechains of comonomer units selected from carboxylic acid, anhydride, salt, or half ester functionality, and optionally a compatible non-grafted ethylene copolymer, and (b) 1 to 35 percent by weight of a tackifying resin exhibits good adhesion properties without the need for a primer.
Bennett Jones Llp
E. I. Du Pont de Nemours And Company
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