Tough epoxy resins

C - Chemistry – Metallurgy – 08 – G

Patent

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Details

400/2014, 400/40

C08G 69/44 (2006.01) C08L 9/02 (2006.01) C08L 63/00 (2006.01) C08L 67/00 (2006.01) C08L 77/00 (2006.01) C08L 77/12 (2006.01)

Patent

CA 2009011

Curable compositions are described comprising A) an epoxy resin having on average more than one epoxide group per molecule, B) a curing agent which can be activated at an elevated temperature for component A), C) a liquid copolymer based on butadiene, acrylonitrile and, if appropriate, further ethylenically unsaturated comonomers, and D) a selected segmented copolymer consisting essentially of recurring soft segments containing polypropylene glycol units or polybutylene glycol units and selected hard segments having a softening point above 25°C. These compositions are suitable for use as, for example, adhesives.

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