Multilayer printed circuit board formation

Details Multilayer printed circuit board formation Multilayer printed circuit board formation

H - Electricity

05

K

356/17, 402/21,

H05K 3/46 (2006.01) H05K 1/03 (2006.01) H05K 3/28 (2006.01) H05K 3/38 (2006.01)

Patent

CA 2031045

31 TITLE MULTILAYER PRINTED CIRCUIT BOARD FORMATION ABSTRACT Multilayer printed circuit boards having a number of through-holes are formed employing intermediate layers in bonding copper circuitry to an insulating layer. 31

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