Making contact with semiconductor chips in chip cards

Details Making contact with semiconductor chips in chip cards Making contact with semiconductor chips in chip cards

G - Physics

06

K

G06K 19/077 (2006.01) H01L 23/31 (2006.01) H01L 23/498 (2006.01)

Patent

CA 2453156

The invention relates to a chip card comprising a chip card base (1), a semiconductor chip (3) and a carrier substrate (2). The carrier substrate (2) is provided on both sides (11, 12) with planar contacts (4, 5) and thereinbetween with contact holes (6), so-called vias, that electrically interlink the upper and the lower planar contacts. Since the interior of the contact holes (6) is hollow, humidity can penetrate the cavities into the interior (20) of the chip card and damage the semiconductor chip if the contact holes (6) are not covered. Covered contact holes (6), however, are expensive to produce. The aim of the invention is therefore to provide chip cards in which humidity is prevented from penetrating into the interior cavity (20) in which the semiconductor chip (3) is mounted without the need for a separate cover for the contact holes (6). The inventive chip card is therefore specifically characterized in that the contact holes (6) are disposed so close to the edge of the carrier substrate (2) that their lower ends lead to the bottom of an exterior cavity (10) where they are sealed.

L'invention concerne une carte à puce comprenant un corps (1), une puce semiconductrice (3) et un substrat support (2). Ce substrat support (2) présente sur les deux faces (11, 12) des contacts plats (4, 5) entre lesquels sont ménagés des trous d'interconnexion (6) qui relient électriquement les contacts plats supérieurs et les contacts plats inférieurs. L'intérieur des trous d'interconnexion (6) étant creux, de l'humidité peut pénétrer à l'intérieur (20) de la carte à puce par les cavités et endommager la puce semiconductrice si les trous d'interconnexion (6) ne sont pas recouverts. La production de trous d'interconnexion (6) recouverts engendre néanmoins des coûts importants. L'objectif de l'invention est de créer des cartes à puce dans lesquelles l'humidité ne peut pas pénétrer dans la cavité intérieure (20) dans laquelle se trouve la puce semiconductrice (3), sans qu'il soit nécessaire de produire pour les trous d'interconnexion (6) un recouvrement individuel. A cet effet, les trous d'interconnexion (6) sont disposés près du bord du substrat support (2) de telle sorte que leur extrémité inférieure débouche dans le fond d'une cavité extérieure (10) où elle est obturée.

Affiliated with

Also associated with

Rating

Making contact with semiconductor chips in chip cards does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Making contact with semiconductor chips in chip cards, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Making contact with semiconductor chips in chip cards will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-1993331