C - Chemistry – Metallurgy – 08 – G
Patent
C - Chemistry, Metallurgy
08
G
C08G 59/18 (2006.01) C08J 3/24 (2006.01) C09D 5/03 (2006.01) C09D 163/00 (2006.01)
Patent
CA 2408653
The invention is directed to new thermosetting powder coating compositions comprising acid functional acrylic resin(s); polyepoxy resin(s) and catalyst(s). The powder coating compositions can be applied to substrates, especially heat sensitive substrates such as wood substrates and cured at low temperature or a higher temperature for a shorter time to provide finishes having controllable gloss and/or high hardness. The invention is also directed to an article comprising a heat sensitive substrate, such as wood substrate, and coated and cured on at least one surface of the substrate the powder coating composition of the invention.
Cette invention concerne des compositions de revêtement en poudre thermodurcissables renfermant une ou plusieurs résines acryliques fonctionnelles acides, une ou plusieurs résines polyépoxydes et un ou plusieurs catalyseurs. Ces compositions peuvent être appliquées sur des substrats, en particulier des substrats sensibles à la chaleur tels que des substrats en bois et durcir à basse température ou à des températures plus élevées pendant un laps de temps réduit pour donner des finitions d'un brillant variable et/ou d'une grande dureté. L'invention concerne également un article comportant un substrat thermosensible tel qu'un substrat en bois dont au moins une surface est enduite de ladite composition en poudre thermodurcissable.
Carlson Brian W.
Hart Stephen C.
Larson Stephen C.
Schmierer Jeffrey G.
H.b. Fuller Licensing & Financing Inc.
Rogers Law Office
LandOfFree
Powder compositions for heat sensitive substrates does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Powder compositions for heat sensitive substrates, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Powder compositions for heat sensitive substrates will most certainly appreciate the feedback.
Profile ID: LFCA-PAI-O-2005812