C - Chemistry – Metallurgy – 08 – L
Patent
C - Chemistry, Metallurgy
08
L
400/4801, 400/63
C08L 9/00 (2006.01) C08K 5/54 (2006.01) C08L 21/00 (2006.01) C08L 25/04 (2006.01) C08L 71/12 (2006.01)
Patent
CA 2010717
- 12 - O.Z. 0050/40641 Abstract of the Disclosure: Thermoplastic molding com- positions contain as essential components (A) 9.9-89.9% by weight of a polyphenylene ether, (B) 10-90% by weight of an aromatic vinyl polymer and (C) 0.1-5% by weight of a low molecular weight compound which contains at least one Si-O-C group and at least one epoxy, nitrogen-containing or sulfur- containing group.
Baumgartner Ehrenfried
Benker Klaus
Boehlke Klaus
Hedtmann-Rein Carola
Muehlbach Klaus
Basf Aktiengesellschaft
Robic Robic & Associes/associates
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