Microwave integrated circuit multi-chip-module and microwave...

Details Microwave integrated circuit multi-chip-module and microwave... Microwave integrated circuit multi-chip-module and microwave...

H - Electricity

05

K

H05K 9/00 (2006.01) H01L 23/552 (2006.01) H01L 23/66 (2006.01)

Patent

CA 2273125

A package substrate 3 has a high frequency transmission line, which is formed by a high frequency circuit layer 8 formed on the surface, a grounding layer 10b formed thereunder and a dielectric ceramic intervening between the layers 8 and 10b, and also has a plurality of MMICs 14. A lid 18 as a shielding member which electromangetically shields the high frequency transmission line and the MMICs 14 from one another, is bonded to the surface of the package substrate 3. The lid 18a has recesses 18a formed such as to face the high frequency transmission line and the MMICs 14. The surface of the package substrate 3 and the outer periphery of the lid 18 are hermetically sealed together by water-resistant resin. Thus, a step of bonding a shielding member is simplified and the yield of hermetic sealing of the bonded part of the shielding member is improved.

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