Process for the manufacture of printed circuit boards with...

H - Electricity – 01 – L

Patent

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Details

H01L 23/48 (2006.01) H01C 17/065 (2006.01) H01L 21/20 (2006.01) H01L 21/302 (2006.01) H01L 21/31 (2006.01) H01L 21/44 (2006.01) H01L 21/461 (2006.01) H01L 21/469 (2006.01) H01L 23/52 (2006.01) H01L 29/40 (2006.01) H05K 1/16 (2006.01) H05K 3/06 (2006.01) H05K 3/18 (2006.01) H05K 3/38 (2006.01)

Patent

CA 2405830

A process and product manufactured by the process is revealed whereby resistors (16) can be manufactured integral a printed circuit board (10, 13) by plating the resistors onto an insulative substrate (10). Uniformization of the insulative substrate by etching and oxidation of the plated resistor are revealed as techniques for improving the uniformity and consistency of the plated resistors.

L'invention concerne un procédé et un produit fabriqué dans lequel les résistances (16) peuvent être fabriquées d'une seule pièce avec une carte de circuit imprimé (10, 13), par métallisation desdites résistantes sur un substrat isolant (10). L'uniformisation du substrat isolant par gravure et oxydation de résistance métallisée est une technique qui permet d'améliorer l'uniformité et la régularité des résistances métallisées.

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