Process for structuring polymer films

Details Process for structuring polymer films Process for structuring polymer films

B - Operations, Transporting

29

C

B29C 71/04 (2006.01) B29C 59/14 (2006.01) H05K 3/00 (2006.01)

Patent

CA 2136361

The invention relates to a process for structuring polymer films, such as e.g. printed circuit boards and film boards, using a plasma, which is formed in a container by the excitation of gas mixtures by microwaves, in which there is a control of the surface temperature of the polymer films during structuring by the plasma and by a corresponding setting of the parameters it is possible to keep just below a material-damaging temperature limit for polymer films, so that structures or microshapes are carefully plasmaeroded in polymer films, in which at high surface temperatures and with a dense plasma structures or microshapes are rapidly eroded by the plasma, in which the structures or microshapes are homogeneously plasma-eroded with a uniform distribution of the surface temperature and gas flow and with a similar arrangement and movement of the polymer films.

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