Method of encapsulating beam lead semiconductor devices

H - Electricity – 01 – L

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356/135, 356/156

H01L 21/00 (2006.01) H01L 21/308 (2006.01) H01L 21/312 (2006.01) H01L 23/31 (2006.01) H01L 23/482 (2006.01)

Patent

CA 912172

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