C - Chemistry – Metallurgy – 07 – C
Patent
C - Chemistry, Metallurgy
07
C
C07C 275/28 (2006.01) C07C 273/18 (2006.01) C07D 295/215 (2006.01) C08G 59/40 (2006.01) C08G 59/46 (2006.01) C08G 59/68 (2006.01)
Patent
CA 2111601
Abstract of the disclosure: Thermosetting compositions based on epoxy resins, dicyandiamide and a curing accelerator having a good ratio between stability and reactivity The use of a compound of the formula 1 Image (1) in which R1 and R3 independently of one another are each an alkyl, cycloalkyl or aryl group, R2 and R4 independently of one another are each an alkyl or aryl group, or R1 with R2 and/or R3 with R4 are each a 1,4-tetramethylene or a 1,5-pentamethylene group, and, finally, R5, R6, R7 and R8 independently of one another are each a hydrogen or halogen atom or a C1-C4alkyl or C1-C4alkoxy group, as curing accelerator for a thermosetting composition comprising at least one epoxy resin and dicyandiamide, corresponding compositions and two advantageous processes for the preparation of compounds of the formula 1 are described. The accelerators of the formula 1 have the advantage that, although they increase the reactivity of the compositions at elevated temperature to an extent comparable to that of good accelerators of the prior art, they do not adversely influence the storage stability of the compositions at room temperature.
Flury Peter
Muhlebach Andreas
Ag Ciba-Geigy
Fetherstonhaugh & Co.
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