Silicon carbide semiconductor device and method of...

H - Electricity – 01 – L

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H01L 21/3105 (2006.01) H01L 21/335 (2006.01) H01L 29/04 (2006.01) H01L 29/12 (2006.01) H01L 29/772 (2006.01)

Patent

CA 2740244

A silicon carbide semiconductor device (1) is provided that includes a semiconductor layer (12) made of silicon carbide and having a surface (12a) with a trench (20) having a sidewall (19) formed of a crystal plane tilted at an angle in a range of not less than 50° and not more than 65° relative to the {0001} plane, and an insulating film (13) formed to contact the sidewall (19) of the trench (20). A maximum value of the nitrogen concentration in a region within 10 nm from the interface between the sidewall (19) of the trench (20) and the insulating film (13) is not less than 1 x 10 21 cm -3, and the semiconductor device has a channel direction in a range of ~10° relative to the direction orthogonal to the <-2110> direction in the sidewall (19) of the trench (20). A method of manufacturing the silicon carbide semiconductor device is also provided.

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