Device and method for material separation using laser...

Details Device and method for material separation using laser... Device and method for material separation using laser...

B - Operations, Transporting

23

K

B23K 26/06 (2006.01) B23K 26/38 (2006.01)

Patent

CA 2619857

The invention relates to a method for material separation using a laser, whereby a sequence of laser pulses (11 to 20) is produced and an area of a material to be treated is irradiated with the sequence of laser pulses (11 to 20). Methods of this type are used to separate a number of different materials. Known methods are problematic in that the surroundings of the area of treatment are thermally or mechanically damaged, leading to non-treated areas of the material being impaired. In order to address this problem, the laser pulse energy of an individual laser pulse of the sequence of laser pulses (11 to 20) is lower than the laser pulse energy required to produce a material separation using an isolated laser pulse in the area irradiated with the individual laser pulse of the sequence of laser pulses (11 to 20).

L'invention concerne un procédé de séparation d'un matériau à l'aide d'un laser. Une séquence d'impulsions laser est générée et une zone du matériau à traiter est exposée à cette séquence d'impulsions laser. De tels procédés sont utilisés pour séparer une série de différents matériaux. L'invention vise à résoudre le problème propre à ce procédé, notamment l'apparition d'un endommagement thermique ou mécanique dans l'environnement de la zone de traitement, ce qui entraîne l'endommagement des zones de matériau non traitées. A cet effet, l'énergie d'une seule impulsion laser de la séquence des impulsions laser est inférieure à l'énergie d'impulsion laser nécessaire à la production d'une séparation de matériau par une impulsion laser isolée dans la zone exposée à l'impulsion laser unique de la séquence d'impulsions laser.

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