H - Electricity – 01 – J
Patent
H - Electricity
01
J
H01J 37/34 (2006.01)
Patent
CA 2327741
A sputtering magnetron with a rotating cylindrical target and a stationary magnet assembly (22, 24*) is described, said magnet assembly (22, 24*) being adapted to produce an elongate plasma race-track on the surface of said target, said elongate race-track having substantially parallel tracks over a substantial portion of its length and being closed at each end by end portions (22'), wherein the spacing between the tracks of said race-track is increased locally to materially effect sputtering onto a substrate. The increase in spacing may be at the end portions or along the parallel track portion. The increase in spacing may provide more even erosion of the target beneath the end portions of the race-track, provide more even coatings on the substrate, for instance.
L'invention concerne un magnétron de pulvérisation pourvu d'une cible cylindrique tournante et d'un ensemble (22, 24*) aimant stationnaire, ledit ensemble (22, 24*) aimant étant conçu pour produire une trajectoire de plasma allongée sur la surface de ladite cible, ladite trajectoire allongée comportant des trajets sensiblement parallèles sur une partie importante de sa longueur, et étant fermée à chaque extrémité par des parties (22') d'extrémité. L'espacement entre les trajets de ladite trajectoire est augmenté localement pour permettre de produire matériellement une pulvérisation sur un substrat. L'augmentation de l'espacement peut se situer aux parties d'extrémité ou le long d'une partie de trajet parallèle. L'augmentation de l'espacement permet d'obtenir une érosion plus régulière de la cible sous les parties d'extrémité de la trajectoire, et de former des revêtements plus réguliers sur le substrat, par exemple.
de Bosscher Wilmert
Lievens Hugo
Bekaert Advanced Coatings N.v.
Sinvaco N.v.
Smart & Biggar
LandOfFree
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