Lead frame attachment for optoelectronic device

Details Lead frame attachment for optoelectronic device Lead frame attachment for optoelectronic device

H - Electricity

01

L

H01L 31/0203 (2006.01) H01L 21/60 (2006.01) H01L 33/00 (2006.01) G02B 6/30 (2006.01) G02B 6/42 (2006.01)

Patent

CA 2338993

An optoelectronic device is mounted on a planar substrate in electrical connection with solder bumps adjacent an edge of the substrate and connection to a lead frame is made by loading the edge of the substrate on a lead frame support with lead frame conductors in engagement with the solder bumps and applying heat to melt the solder.

Un dispositif optoélectronique monté sur un substrat plane est raccordé électriquement à des plots de soudure placés sur l'un des bords du substrat. La fixation du substrat au cadre porte-conducteurs se fait en chargeant ledit bord du substrat sur un support de cadre porte-conducteurs et en mettant les conducteurs en contact avec les susdits plots qu'on chauffe pour faire fondre la soudure.

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