High-melting polyamide resin compositions and molded...

Details High-melting polyamide resin compositions and molded... High-melting polyamide resin compositions and molded...

C - Chemistry, Metallurgy

08

K

C08K 5/3492 (2006.01) C08K 5/15 (2006.01) C08L 77/00 (2006.01)

Patent

CA 2278018

High-melting polyamide resin compositions having improved mechanical properties, and molded articles for electrical and electronic components made using the same. The high-melting polyamide resin compositions comprise an aromatic polyamide having a melting point of 280 °C to 340 °C and glycidyl isocyanurate, a novolak-epoxy resin, or mixtures thereof.

Compositions de résine de polyamide présentant un point de fusion élevé et des propriétés mécaniques améliorées, ainsi qu'articles moulés pour composants électriques et électroniques, fabriqués au moyen de ces compositions. Ces compositions contiennent un polyamide aromatique présentant un point de fusion de 280 DEG C à 340 DEG C et isocyanurate de glycidyle, une résine époxy-novolak, ou ses mélanges.

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