Pickup method and the pickup apparatus for chip-type part

Details Pickup method and the pickup apparatus for chip-type part Pickup method and the pickup apparatus for chip-type part

H - Electricity

01

L

H01L 21/70 (2006.01) H01L 21/00 (2006.01) H01L 21/48 (2006.01) H05K 13/04 (2006.01)

Patent

CA 2031776

Abstract of the Disclosure The present invention has an object to provide a pickup method and the pickup apparatus for chip type part capable of storing a part of chip type part kept adhered with a sufficient adhesive strength on an adhesive layer such as an expanded tape for a strage purpose while the other part of chip type part is adhered on the adhesive layer for current use. In order to achieve the object, there is provided a pickup technique for chip type part wherein an energy beam is radiated on a part of adhesive layer fixing the chip type part.

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