Laser cutting apparatus

Details Laser cutting apparatus Laser cutting apparatus

B - Operations, Transporting

23

K

B23K 26/00 (2006.01) B23K 26/02 (2006.01) B23K 26/067 (2006.01) B23K 26/36 (2006.01)

Patent

CA 2172530

An apparatus (10) for cutting a material (40) having a thickness, T, defined by the distance between a first surface (46) and a second surface (42) of the material (40). The apparatus (10) comprises an energy source (12) for providing a beam of energy (14), and directing mirrors for directing the beam of energy from the energy source to a first focal point (80) between the first and second surfaces (46, 42) of the material, and to a second focal point (98) between the first and second surfaces (46, 42) of the material (40). The first and second focal points (80, 98) are spaced apart from each other by a distance sufficient to cut through the entire thickness of the material (40).

Appareil (10) servant à couper un matériau (40) présentant une épaisseur T définie par la distance entre une première surface (46) et une seconde surface (42) du matériau. L'appareil (10) comprend une source d'énergie (12) produisant un faisceau d'énergie (14), ainsi que des miroirs directifs permettant de diriger le faisceau de la source d'énergie vers un premier point focal (80) situé entre les première et seconde surfaces (46, 42) du matériau (40), et vers un second point focal (98) également situé entre les première et seconde surfaces (46, 42) du matériau (40). Lesdits premier et second points focaux (80, 98) sont suffisamment espacés l'un de l'autre pour permettre au faisceau de traverser toute l'épaisseur du matériau (40) en le coupant.

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