Solder paste formulation containing stannous fluoride

Details Solder paste formulation containing stannous fluoride Solder paste formulation containing stannous fluoride

B - Operations, Transporting

23

K

148/60, 356/8

B23K 35/363 (2006.01) B23K 35/36 (2006.01) H05K 3/34 (2006.01)

Patent

CA 2023949

19 PE-0142 TITLE IMPROVED SOLDER PASTE FORMULATION CONTAINING STANNOUS FLUORIDE ABSTRACT An improved solder paste composition suitable for screen or stencil printing with a capability for low ionic contamination after soldering comprising a metal or metal alloy powder, a carrier, and stannous fluoride. 19

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