Substrate processing apparatus and method

Details Substrate processing apparatus and method Substrate processing apparatus and method

H - Electricity

01

L

H01L 21/02 (2006.01) H01L 21/00 (2006.01) H01L 21/68 (2006.01) H01L 21/687 (2006.01)

Patent

CA 2231852

One wafer is placed on a wafer support table with its frontside facing upward, and the other wafer is chucked by a wafer chuck portion with its frontside facing upward. The wafer chuck portion is pivoted about a shaft through about 180° to make the two wafers face each other substantially parallel. In response to the cancel of the chucking of the upper wafer by the wafer chuck portion, the central portion of the upper wafer is pressed by a press pin to superimpose the two wafers.

Une plaquette est placée face vers le haute sur une table de support et une seconde plaquette est montée face vers le haut sur une pièce de fixation. Cette pièce de fixation est soumise à une rotation d'environ 180 degrés autour d'un axe qui place les deux plaquettes face à face et à peu près parallèles. La plaquette de dessus est ensuite libérée de la pièce de fixation et sa partie centrale est pressée contre la plaquette de dessous sous l'effet d'un organe de pression.

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