Embedded metallic deposits

Details Embedded metallic deposits Embedded metallic deposits

B - Operations, Transporting

29

C

B29C 45/17 (2006.01) B22D 19/00 (2006.01) G01N 27/30 (2006.01) G01N 27/403 (2006.01) H05K 3/04 (2006.01)

Patent

CA 2324827

A method of making a set of metallic deposits includes injection molding a substrate, where a pattern of channels is in a surface of the substrate, applying a metallic layer on the surface, to form metallic deposits in the pattern, and removing a portion of the metallic layer, to expose a portion of the surface. The set of metallic deposits can form an electrode set for an electrochemical sensor strip.

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