Printed circuit board plating process

Details Printed circuit board plating process Printed circuit board plating process

H - Electricity

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H05K 3/02 (2006.01) H05K 1/02 (2006.01) H05K 3/06 (2006.01) H05K 3/24 (2006.01) H05K 3/34 (2006.01) H05K 1/11 (2006.01) H05K 3/28 (2006.01) H05K 3/42 (2006.01)

Patent

CA 1060586

PRINTED CIRCUIT BOARD PLATING PROCESS ABSTRACT OF THE DISCLOSURE A process for manufacturing printed circuit boards wherein a layer of Nickel is plated atop a layer of copper in a pattern corresponding to a desired circuit configuration. The Nickel is used as an etch resist to remove copper from the board in the non-conductive areas. Subsequently, the Nickel is chemically activated such that it will accept a coating of solder particularly at the connection points and in the through-holes.

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