Paperboard substrate for blister packaging

Details Paperboard substrate for blister packaging Paperboard substrate for blister packaging

B - Operations, Transporting

32

B

B32B 3/26 (2006.01) A61B 19/02 (2006.01) A61J 1/03 (2006.01) B32B 7/10 (2006.01) B32B 27/08 (2006.01) B32B 27/10 (2006.01) B65D 75/36 (2006.01)

Patent

CA 2474745

A packaging laminate comprising a paperboard substrate for providing a base layer, a tear-resistant polymer layer applied to said substrate, and a heat seal polymer layer applied to said tear-resistant polymer. This laminate structure is particularly useful for blister pack packaging.

L'invention porte sur un laminé pour emballages comportant un substrat de base de carton, une couche de polymère indéchirable appliquée sur ledit substrat, et une couche thermoscellable appliquée sur ledit polymère. Cette structure est particulièrement adaptée aux emballages-coques.

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