Sealant compositions and sealant articles using the same

Details Sealant compositions and sealant articles using the same Sealant compositions and sealant articles using the same

C - Chemistry, Metallurgy

09

J

C09J 177/00 (2006.01) C08L 63/00 (2006.01) C08L 77/00 (2006.01) C09J 5/06 (2006.01) C09J 7/00 (2006.01) C09J 7/02 (2006.01) C09J 163/00 (2006.01) C09J 177/08 (2006.01) C09K 3/10 (2006.01)

Patent

CA 2353882

A sealant composition comprising a curable epoxy-containing material, a thermoplastic polyamide component having a melting point lower than a curing temperature of the epoxy-containing material, and a curative for the epoxy- containing material. After curing of the epoxy-containing material, the sealant composition exhibits an elongation at -20 ~C of at least 2 . The sealant composition is capable of effectively sealing discontinuities while maintaining enough flexibility to absorb applied stress, thereby preventing the formation of defects in the sealant which permit the intrusion of dirt, moisture, and other undesirable substances.

L'invention concerne une composition de scellement qui comprend une substance durcissable contenant de l'époxy, un composant de polyamide thermoplastique possédant un point de fusion inférieur à la température de durcissement de la substance contenant de l'époxy et un agent de durcissement pour la substance contenant de l'époxy. Après le durcissement de la substance contenant de l'époxy, la composition de scellement manifeste une élongation d'au moins 2 à20 ·C. La composition de scellement permet de sceller efficacement les discontinuités de scellement tout en gardant suffisamment de souplesse pour absorber la contrainte appliquée et empêcher ainsi la formation dans l'agent de scellement de défauts susceptibles de permettre la pénétration de la boue, de l'humidité et d'autres substances indésirables.

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